Shengquan New Materials plans $35M specialty epoxy resin project

Shandong Shengquan New Materials plans to invest 2.5 billion yuan to build a chip packaging electronic-grade specialty epoxy resin and monomer project, adding annual capacity of 11,000 tonnes of specialty epoxy resin and 7,950 tonnes of monomers.

“圣泉新材料计划投资2.5亿元建设芯片封装用电子级特种环氧树脂及单体项目。”m.ccin.com.cn

• 1 source
• m.ccin.com.cn圣泉新材料拟建特种环氧树脂项目 - 中化新网TOPQHSep 8, 2026

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