Foxconn, Radiall and Thales launch Tessalia joint venture for semiconductor assembly in Le Barp

Foxconn, Radiall and Thales laid the foundation stone for Tessalia Technology SAS, a joint venture in Le Barp, France, dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). The facility aims to produce more than 50 million System in Package (SiP) components per year by 2033.

“This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT).”lifeofsoldiers.com

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• lifeofsoldiers.comFoxconn, Radiall and Thales inaugurate Tessalia to produce more than 50 million “made in Europe” components annually - Life of SoldiersTeam LoSJun 2, 2026

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