Applied Materials and Besi launch Kinex hybrid bonding system

Applied Materials and BE Semiconductor Industries introduced Kinex, the industry's first integrated die-to-wafer hybrid bonding system, combining all critical process steps in a single tool for advanced logic and memory chips.

“Applied Materials and BE Semiconductor Industries (Besi) have introduced Kinex, the industry's first integrated die-to-wafer hybrid bonding system, engineered to deliver higher performance and lower power consumption for advanced logic and memory chips.”blog.baldengineering.com

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• blog.baldengineering.comBALD Engineering - Born in Finland, Born to ALD: Applied Materials Deepens Partnership with Besi and Launches Kinex™ – the Industry’s First Fully Integrated Die-to-Wafer Hybrid Bonding System for Next-Gen AI and Memory ChipsJonas SundqvistNov 8, 2025

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