Applied Materials acquires 9% stake in Besi

Applied Materials acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their collaboration on hybrid bonding technology for advanced semiconductor packaging.

“Applied Materials announced it has acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their ongoing collaboration on hybrid bonding technology for advanced semiconductor packaging.”blog.baldengineering.com

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• blog.baldengineering.comBALD Engineering - Born in Finland, Born to ALD: Applied Materials Deepens Partnership with Besi and Launches Kinex™ – the Industry’s First Fully Integrated Die-to-Wafer Hybrid Bonding System for Next-Gen AI and Memory ChipsJonas SundqvistNov 8, 2025

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