Beijing Yandong Microelectronics Technology

BOE Technology Group, through its subsidiary Tianjin BOE Innovation Investment, is collaborating with partners to invest 33 billion yuan ($4.55 billion) in a new 12-inch integrated circuit production line at Beijing Electronic Control Integrated Circuit Manufacturing Co. The project targets 28nm to 55nm process nodes, with mass production expected by end of 2026 and monthly capacity of 50,000 wafers by 2030.