Sechan Electronics Inc. was one of eight small businesses awarded a $14,705,110 five-year firm-fixed-price multiple award contract by the Naval Surface Warfare Center, Crane Division, for build-to-print circuit card assemblies for military projects, including helicopter systems.
Qorvo was awarded a three-year contract by the Department of Defense to advance copper-pillar-on-GaN flip-chip technology for phased array radar and defense electronics, aiming for Manufacturing Readiness Level 9 by 2022.
The Naval Surface Warfare Center, Crane Division awarded contracts to Intel, Xilinx, Northrop Grumman, GE Research, Keysight Technologies, and Qorvo Texas for the initial phase of the SHIP microelectronics development project.
SAIC won a $57 million Seaport-e task order to provide engineering support services to the Polymers and Undersea Sensors Branch at the Naval Surface Warfare Center, Crane Division.