Chiplet Semiconductor starts construction of advanced packaging module plant in Nantong

Chiplet Semiconductor (Nantong) Co., Ltd. began construction of a CNY 1.05 billion advanced packaging (Chiplets) module manufacturing plant at Nantong High-tech Zone on February 9, 2025.

“此次开工的制局半导体（南通）有限公司先进封装（Chiplets）模组制造项目总投资10.5亿元。”tongzhou.gov.cn

• 1 source
• tongzhou.gov.cn制局半导体先进封装模组制造项目开工-南通市通州区人民政府Feb 9, 2025

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