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UMC wins Qualcomm advanced packaging deal for HPC chips · Endata

◂ Announcements

Dec 17, 2024CONTRACT

UMC wins Qualcomm advanced packaging deal for HPC chips

United Microelectronics Corporation (UMC) has reportedly secured an advanced packaging order from Qualcomm for high-performance computing chips, breaking TSMC's monopoly. The chips are expected to enter trial production in H2 2025 and mass production in 2026.

Status

Announced

Productsadvanced packaging for HPC chipsinterposersWafer-on-Wafer hybrid bonding

CompaniesUnited Microelectronics Corporation Qualcomm customer

Sectors#Semiconductors and Industrial Electronics

“UMC has secured a major advanced packaging order from Qualcomm for high-performance computing (HPC) applications.”trendforce.com

1 source
trendforce.com[News] UMC Reportedly Wins Qualcomm Advanced Packaging Deal, Breaking TSMC’s MonopolyDec 17, 2024

Summarized from public sources; check the original articles before acting on it.

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Apr 2, 2024CONTRACT
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Jul 10, 2023ACQUISITIONXiamen, China$784.0M
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Mar 23, 2023CONTRACTSingapore, Singapore$205.3M
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Mar 7, 2023CONTRACTSingapore, Singapore
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