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SK Hynix orders TC bonding equipment from ASMPT · Endata

◂ Announcements

Semiconductors and Industrial Electronicsworld trade 2024+6.8% 5Y CAGR

Oct 15, 2024CONTRACTSouth Korea

SK Hynix orders TC bonding equipment from ASMPT

SK Hynix has ordered over 30 TC bonding devices from ASMPT for the production of its 12-layer HBM3E high bandwidth memory chips. The equipment will be used in MR-MUF packaging technology.

Status

Announced

ProductsTC bonding devicesHBM3E memory chips

CompaniesSK Hynix customer ASMPT supplier

Sectors#Semiconductors and Industrial Electronics

“SK Hynix has ordered over 30 TC bonding devices from well-known packaging and testing equipment manufacturer ASMPT for the production of its latest generation of high bandwidth memory chips -12 layer HBM3E.”rxelectronics.com

1 source
rxelectronics.comSK Hynix orders TC bonding equipment from ASMPT - rxelectronicsRxelectronics.comOct 15, 2024

Summarized from public sources; check the original articles before acting on it.

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