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BAE Systems and GlobalFoundries have agreed to align technology roadmaps and collaborate on R&D for packaging, GaN-on-Si, silicon photonics, and process development for secure chips used in aerospace and defense systems. The non-exclusive partnership leverages BAE's microelectronics expertise and GlobalFoundries' volume semiconductor manufacturing.
“BAE Systems and GlobalFoundries are to align technology roadmaps and collaborate on long-term strategies for US fabrication and packaging of secure chips for use in aerospace and defense systems.”electronicsweekly.com
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