Samsung wins Nvidia 2.5D packaging order

Samsung has won an order from Nvidia to provide its I-Cube 2.5D packaging for Nvidia's AI chips. Samsung's Advanced Package team will supply the interposer and packaging, while HBM and GPU wafer production will be handled by others.

“Samsung has won Nvidia as a customer for 2.5D packaging, TheElec has learned.”thelec.net

• 1 source
• thelec.netSamsung wins Nvidia’s 2.5D package order < Semiconductor < 기사본문 - The Elec Inc.Noh Tae Min 기자Apr 7, 2024

Summarized from public sources; check the original articles before acting on it.