Loading…

ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

HOME BRIEF PROSPECTS SECTORS ANNOUNCEMENTS COMPANIES COUNTRIES

>

INDUSTRIAL MARKET INTELLIGENCE

ANNOUNCEMENTSAll New facility Expansion Investment Acquisition Contract Closure

INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

Foxconn and HCL Group form chip packaging joint venture in India · Endata

◂ Announcements

Jan 17, 2024PARTNERSHIPIndia

Foxconn and HCL Group form chip packaging joint venture in India

Foxconn (Hon Hai Precision Industry) partners with HCL Group to form a chip packaging and testing (OSAT) joint venture in India. Foxconn unit will invest $37.2 million for a 40% stake.

Value

$37.2M

Status

Announced

Productschip packaging and testing services

CompaniesFoxconn partner HCL Group partner

Sectors#Semiconductors and Industrial Electronics

“Foxconn, also known as Hon Hai Precision Industry, said it is partnering with India’s HCL Group to start a chip packaging and testing venture in the country.”moneycontrol.com

1 source
moneycontrol.comFoxconn, HCL Group to form chip packaging, testing joint venture in IndiaDanish KhanJan 17, 2024

Summarized from public sources; check the original articles before acting on it.

More from Foxconn

Nov 2, 2026ACQUISITIONNew York and Salem, Oregon, United States$465.0M
Churchill Capital Corp XI to merge with Agility Robotics
Agility Robotics Agility Robotics target globenewswire.com agilityrobotics.com garp.fun
Nov 2, 2026INVESTMENTUnited States$465.0M
Agility Robotics to list on Nasdaq via SPAC merger with $2.5B valuation
Agility Robotics Churchill Capital Corp XI partner peepalsglobal.com aiblog.com.my
Feb 6, 2024PARTNERSHIPIndia
Foxconn and HCL Group to form chip packaging and testing joint venture in India
Foxconn partner HCL Group partner quantumfabsemi.com
Jan 20, 2024PARTNERSHIPIndia$37.2M
Foxconn and HCL Group form joint venture for OSAT facility in India
Foxconn partner HCL Group partner sdxcentral.com
Dec 15, 2023PARTNERSHIP
Foxconn partners with Porotech for MicroLED microdisplays for AR
Foxconn partner Porotech partner foxconn.com
Aug 2, 2023INVESTMENTKarnataka, India$600.0M
Foxconn to invest $600 million in Karnataka, India for iPhone components and chip equipment
Foxconn reuters.com

Similar announcements

Nov 4, 2026NEW FACILITYBengaluru and Vijayapura district, Karnataka, India
Tonbo Imaging seeks land for HPM manufacturing and testing facilities in Karnataka
Tonbo Imaging thehindubusinessline.com
Nov 4, 2026INVESTMENTVijayapura district, Karnataka, India
Tonbo Imaging plans testing facility in Vijayapura, Karnataka
Tonbo Imaging India Limited thebengalurulive.com
Nov 4, 2026PARTNERSHIP
Vertiv and Infineon sign three-year strategic agreement for power semiconductors
Vertiv Infineon Technologies AG partner vertiv.com
Nov 3, 2026PARTNERSHIP
ECARX and Arm to explore next-gen AI computing platforms
ECARX partner Arm partner autonews.gasgoo.com
Nov 3, 2026INVESTMENTHaryana, India1,000 jobs
Kaynes Semicon signs MoU with Haryana for ₹500 crore manufacturing facility
Kaynes Semicon Haryana Enterprises Promotion Centre partner semiconinsider.com
Nov 2, 2026PARTNERSHIPChina
CATL partners with Blue Vector on eVTOL batteries
CATL supplier Blue Vector Intelligent Technology customer autonews.gasgoo.com