Feb 6, 2024PARTNERSHIPIndia Foxconn and HCL Group to form chip packaging and testing joint venture in India
Foxconn and HCL Group announced plans to form a joint venture for chip packaging and testing (OSAT) in India.
Productschip packaging and testing services
“Foxconn, HCL Group to form chip packaging, testing joint venture in India”quantumfabsemi.com
- 1 source
- quantumfabsemi.comFoxconn, HCL Group to form chip packaging, testing joint venture in India - Quantumfab Semiconductor Private LimitedjbadminFeb 6, 2024
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