CDIL Semiconductors to add new assembly lines, increasing capacity by 100 million units

CDIL Semiconductors will add new semiconductor packaging lines via the Indian government's SPECS scheme, aiming to increase annual capacity by 100 million units. The first phase, a surface mount packaging line of 50 million devices, will be inaugurated on September 28, 2023.

“CDIL Semiconductors will be adding new semiconductor packaging lines via the Government of India and MeitY’s SPECS scheme.”cdil.com

• 1 source
• cdil.comCDIL Semiconductors to add new assembly lines, to increase its capacity by 100 Million Units — News | Continental Device India Ltd (CDIL)CDILSep 21, 2023

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