Dongni Electronics signs silicon carbide substrate supply contract

Dongni Electronics' subsidiary Dongni Semiconductor signed a contract with customer T to deliver 135,000 6-inch silicon carbide substrates in 2023 for a total of RMB 675 million, with further deliveries planned for 2024 and 2025.

“东尼电子发布公告称，公司子公司东尼半导体与下游客户T签订《采购合同》，约定东尼半导体2023年向该客户交付6英寸碳化硅衬底13.50万片，含税销售金额合计人民币6.75亿元”spec.icspec.com

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• spec.icspec.com东尼电子斩获碳化硅衬底大单，2022年净利最高同比预增229.20% | icspec-芯片规格书搜索工具May 14, 2023

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