Wingtech to invest CNY 3B expanding Nexperia chip packaging plant in Dongguan

Wingtech Technology announced plans to invest CNY 3 billion (USD 411 million) to expand capacity at the semiconductor packaging and testing plant of Nexperia Semiconductors China in Dongguan, Guangdong. Construction will begin within 12 months and be completed in 1.5 years.

“Wingtech Technology has announced plans to invest CNY3 billion (USD411 million) expanding capacity at the semiconductor packaging and testing plant of Nexperia Semiconductors China.”yicaiglobal.com

• 1 source
• yicaiglobal.comChina’s Wingtech to Spend USD411 Million Expanding Nexperia’s Chip Packaging, Testing PlantTang ShihuaOct 25, 2022

Summarized from public sources; check the original articles before acting on it.