Infineon starts construction of wafer fab module in Kulim, Malaysia

Infineon held a foundation stone laying ceremony for a new wafer fab module in Kulim, Malaysia, with an investment of more than RM8 billion. The module will add manufacturing capacity for power semiconductors, especially silicon carbide and gallium nitride wide bandgap technology. Construction is expected to be completed by Q3 2024.

“With more than RM8 billion worth of investment, the third module will add significant manufacturing capacity in power semiconductors, particularly wide bandgap technology based on silicon carbide and gallium nitride.”mida.gov.my

• 1 source
• mida.gov.myInfineon Lays A Momentous Foundation of The New State-Of-The-Art Wafer Fab Module in Kulim - MIDA | Malaysian Investment Development AuthorityJul 7, 2022

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