Fastprint Circuit Tech to build $949M chip packaging substrate plant in Guangzhou

Fastprint Circuit Tech will invest CNY6 billion (USD949 million) to build a plant in Guangzhou, China, to produce 20 million flip chip ball grid array substrates per month, with first phase operational by June 2025 and full capacity by December 2027.

“China's Fastprint Circuit Tech will invest CNY6 billion (USD949 million) to build a plant to satisfy mostly domestic clients' demand for semiconductor packaging solutions amid the global chip shortage.”yicaiglobal.com

• 1 source
• yicaiglobal.comFastprint Aims to Meet Chinese Demand for Chip Packaging Substrates With New USD949 Million PlantTang ShihuaFeb 9, 2022

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