Intel to invest $3.5 billion in New Mexico semiconductor packaging facility

Intel announced a $3.5 billion investment to equip its Rio Rancho, New Mexico operations for advanced semiconductor packaging technologies, including Foveros 3D packaging. The project is expected to create 700 high-tech jobs and 1,000 construction jobs.

“A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products.”intc.com

• 4 sources
• intc.comIntel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations :: Intel Corporation (INTC)May 3, 2021
• governor.state.nm.usNew Mexico applauds Intel's $3.5 billion expansion in Rio ...May 3, 2021
• krqe.comIntel announces $3.5B expansion to Rio Rancho facility to manufacture semiconductorsKRQE StaffMay 3, 2021
• silicon.co.ukIntel To Invest $3.5bn New Mexico Factory | Silicon UK Tech NewsTom JowittMay 4, 2021

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