Zhen Ding to build IC substrate plant in Shenzhen, China

Zhen Ding Technology signed a land-use agreement for a 1.73-ping (57,000 sq m) site in Shenzhen's Bao'an district to build an ABF and BT substrate plant via subsidiary Liding Semiconductor. The plant is expected to be installed by end-2022 and start production in 2023.

“臻鼎-KY主管指出，禮鼎半導體在取得深圳市寶安區的1.73萬坪土地的使用權後，規劃在2022年底完成土建及設備裝機，於2023年正式投產”news.cnyes.com

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• news.cnyes.com臻鼎跨大步 新設海內外IC載板、軟板及SMT廠 預計後年投產 | 鉅亨網 - 台股新聞Feb 18, 2021

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