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Danfoss signs multi-year volume agreement with Infineon for power semiconductors · Endata

◂ Announcements

Jun 17, 2020CONTRACTGermany

Danfoss signs multi-year volume agreement with Infineon for power semiconductors

Danfoss has signed a multi-year volume agreement with Infineon for IGBT and diode chipsets, to be used in power modules for electric vehicle inverters. Chips will be supplied from Infineon's Villach and Dresden plants.

Status

Completed

ProductsIGBTsdiodespower modules for EV inverters

CompaniesDanfoss customer Infineon supplier

Sectors#Automotive Components #Semiconductors and Industrial Electronics

“Für den steigenden Marktbedarf an Leistungshalbleitern für Elektroautos hat Danfoss einen mehrjährigen Volumenvertrag mit Infineon geschlossen.”elektroniknet.de

1 source
elektroniknet.deDanfoss schließt mehrjährigen Volumenvertrag mit Infineon - Automotive > Elektromobilität - ElektroniknetJun 17, 2020

Summarized from public sources; check the original articles before acting on it.

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