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Teledyne selects onsemi's Treo platform for infrared imaging ASICs · Endata

◂ Announcements

May 25, 2018CONTRACT

Teledyne selects onsemi's Treo platform for infrared imaging ASICs

onsemi announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) ASICs for infrared imaging systems for aerospace, defense, security, and scientific applications.

Status

Announced

Productsreadout integrated circuit ASICsinfrared imaging systems

Companiesonsemi Teledyne Technologies customer

Sectors#Semiconductors and Industrial Electronics

“onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems.”business.sherbrookerecord.com

1 source
business.sherbrookerecord.comContact Us - Sherbrooke Record - onsemi’s Treo Platform Selected by Teledyne for Advanced Infrared Imaging DesignMay 25, 2018

Summarized from public sources; check the original articles before acting on it.

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