Qualcomm and USI form joint venture for SiP modules in Brazil

Qualcomm and Universal Scientific Industrial signed an agreement to form a joint venture in Brazil to design and manufacture system-in-package modules for smartphones and IoT devices, expected to start production in 2020.

“The JV will produce system-in-package modules powered by Qualcomm chipsets and the modules include, in a single component, the RF and digital components for smartphones and IoT devices.”circuitsassembly.com

• 1 source
• circuitsassembly.comCircuits Assembly Online Magazine - Qualcomm, USI Set Up JV to Build SiP Modules in BrazilMike BuetowFeb 6, 2018

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