GE Ventures and Samsung Electro-Mechanics sign microelectronics packaging patent license agreement

GE Ventures and Samsung Electro-Mechanics announced a multi-year, worldwide patent license agreement for GE's microelectronics packaging patent portfolio, covering fabrication of substrates embedded with electronic circuits.

“GE is extremely pleased that SEMCO has recognized the significance of GE's IP in this space.”ge.com

• 1 source
• ge.comGE Ventures and Samsung Electro-Mechanics Announce Global Microelectronics Packaging Patent Agreement | GE NewsFeb 16, 2017

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