Powertech Technology and Broadcom plan $400M packaging JV in Singapore

Powertech Technology and Broadcom intend to establish a $400 million advanced-packaging joint venture in Singapore, with production potentially beginning in 2028.

“The company is collaborating with AMD and Broadcom and intends to establish a $400 million advanced-packaging joint venture with Broadcom in Singapore.”ganjingworld.com

• 1 source
• ganjingworld.comAI Chip Packaging Race Intensifies as Nvidia, AMD and Broadcom Turn to New Suppliers | Gan Jing WorldNov 6, 2026

Summarized from public sources; check the original articles before acting on it.