JCET to build $1.15B advanced chip packaging plant in Shanghai

JCET will invest 7.8 billion yuan ($1.15 billion) to build an advanced packaging and testing factory in Shanghai's Lin-gang Special Area. The project will be rolled out in two phases, with the first phase scheduled for completion in the second half of 2028.

“Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics Technology (JCET) says it will invest 7.8 billion yuan (US$1.15 billion) to build a new plant.”scmp.com

• 1 source
• scmp.comChina’s JCET to build new plant in Shanghai to expand advanced chip packaging | South China Morning PostXinmei ShenJun 25, 2026

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