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Semiconductors and Industrial Electronicsworld trade 2024+6.8% 5Y CAGR

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Nov 1, 2023NEW FACILITYLingang, Shanghai, China, China

JCET to build automotive chip advanced packaging factory in Shanghai

JCET Group announced a capital increase of RMB 4.4 billion for its holding company JCET Automotive Electronics to accelerate construction of an advanced packaging facility for automotive chips in Lingang, Shanghai. The project started in August 2023 and is expected to be completed in 2025.

Value

$602.0M (4.40B CNY)

Starts operating

2025

Status

Under construction

Capacity

factory area of approximately 200,000 square meters

Productsautomotive chip advanced packaging

CompaniesJCET

Sectors#Semiconductors and Industrial Electronics #Automotive Components

“JCET is proud to announce that its holding company, JCET Automotive Electronics (Shanghai) Co., Ltd. is set to receive a capital increase of RMB 4.4 billion, resulting in a registered capital of RMB 4.8 billion.”jcetglobal.com

1 source
jcetglobal.comJCET Group —— News DetailNov 1, 2023

Summarized from public sources; check the original articles before acting on it.

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