Tower Semiconductor plans to expand 300mm capacity in Japan

Tower Semiconductor announced plans to expand its 300mm capacity in Japan as part of a strategic restructuring. The company will take full ownership of the 300mm facility (Fab 7) and targets capacity expansion to 40,000 wafers per month, with a potential second phase to reach 60,000 wafers per month, contingent on METI subsidy approval.

“Tower targets the combined capacity across the existing facility and the new expansion to reach 40,000 wafers per month, with a potential second phase to bring total capacity to 60,000 wafers per month.”marketscreener.com

• 2 sources
• marketscreener.comTower Semiconductor Announces Plans to Expand 300mm Capacity in Japan to Support Strong Customer Demand | MarketScreenerAcquiremediaMar 25, 2026
• news.mynavi.jpTowerが魚津工場の300mmプロセス製造能力を増強へ、最大4倍の拡大を計画 | TECH+（テックプラス）著者： 小林行雄Mar 26, 2026

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