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DIC Corporation will invest 9 billion yen (approx. 405 million RMB) to build a new semiconductor epoxy resin production line at its Chiba Factory. Construction starts in 2026, with production launch scheduled for July 2029, increasing overall capacity by 59%.
“The total investment for this project is 9 billion yen, approximately 405 million RMB, with the core construction being a brand-new semiconductor epoxy resin production line.”news.chemnet.com
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