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Advanced Echem Materials, Nan Pao Resins Chemical and Trusval Technology announced a joint venture, Advanced Pao Trusval Technology, to produce high-performance adhesive materials for advanced chip packaging. The JV has initial capital of NT$500 million (US$16.35 million).
“The new venture, Advanced Pao Trusval Technology Co, is expected to help strengthen the localization of key semiconductor material supply and enhance material self-sufficiency.”taipeitimes.com
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