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河南慧通芯安科技有限公司 (Huitong Xin'an) started construction of a high-performance AI sensor chip R&D and manufacturing project in the Henan Electronic Semiconductor Industrial Park, Pingdingshan. The project involves a total investment of 260 million yuan and plans to produce 1.2 million chip-level modules per year.
“该项目由河南慧通芯安科技有限公司投资建设,总投资2.6亿元,规划建设年产120万片芯片级模组生产线及AI系列产品。”weidong.gov.cn
Summarized from public sources; check the original articles before acting on it.