Sumitomo Bakelite completes new plant for semiconductor encapsulation materials in Suzhou

Sumitomo Bakelite (Suzhou) has completed construction of a new plant for epoxy resin molding compounds for semiconductor encapsulation in Suzhou Industrial Park. The plant will expand total production capacity by 1.3 times and is scheduled to begin mass production in 2025.

“The new plant will ensure sufficient supply capacity by securing new land and building a plant in the Suzhou Industrial Park so as to expand SSB's total production capacity by 1.3 times.”sumibe.co.jp

• 1 source
• sumibe.co.jpCompletion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices | Sumitomo Bakelite Co., Ltd.Oct 28, 2024

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