Sanan Semiconductor begins equipment move-in for 8-inch SiC chip fab M6B

Sanan Semiconductor held an equipment move-in ceremony for its chip fab M6B, part of its 160 billion RMB SiC project. The fab is expected to achieve first light and start 8-inch SiC chip production by December 2024.

“这标志着三安SiC项目二期通线在即，将为全面加速8吋SiC产业布局，实现产线正式投产奠定良好基础。”sanan-semiconductor.com

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• sanan-semiconductor.com全面加速8吋SiC产业布局，三安半导体芯片二厂设备正式搬入-新闻中心-三安半导体Jul 25, 2024

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