◂ Announcements

May 13, 2024CONTRACT

BE Semiconductor to supply 26 hybrid bonding systems to major chipmaker

BE Semiconductor (Besi) announced it will supply 26 hybrid bonding systems to an unnamed major chip producer, likely Intel or TSMC. The systems will be delivered in Q4 2024-Q1 2025.

Status

Announced

Productshybrid bonding systems

CompaniesBE Semiconductor

Sectors#Semiconductors and Industrial Electronics

“Besi currently supplies hybrid bonding machines to two customers, whose options are actually only TSMC and Intel.”techzine.eu

1 source
techzine.euBE Semiconductor closes lucrative chip deal with (presumably) Intel - Techzine GlobalErik van KlinkenMay 13, 2024

Summarized from public sources; check the original articles before acting on it.

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