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EnSilica entered into a binding Letter of Intent for the development and supply of a high-end ASIC for telecommunications infrastructure, with work starting in January 2024 and initial production anticipated by end of 2026; the final contract is expected to be worth over US$35 million over ten years.
“EnSilica awarded initial mandate for a high-end telecoms ASIC worth in excess of US$35m”investegate.co.uk
Summarized from public sources; check the original articles before acting on it.