Micross receives $134M Army agreement for advanced packaging ecosystem

Micross Advanced Interconnect Technologies received a $134.3 million other transaction authority agreement from the U.S. Army to develop a domestic open-access ecosystem for 2.5D and 3D packaging production in Durham, North Carolina, through November 2028.

“Micross Advanced Interconnect Technologies has received a $134.3 million other transaction authority agreement from the U.S. Army to develop a domestic, open-access ecosystem for 2.5D and 3D packaging production.”govconwire.com

• 2 sources
• govconwire.comMicross Secures $134M Army Advanced Packaging Ecosystem CTA Agreement - GovCon WireNaomi CooperNov 14, 2023
• afcea.orgArmy Develops Semiconductor Packaging | AFCEA InternationalDec 6, 2023

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