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Zhengqi Semiconductor's Hangzhou project will build a third-generation semiconductor module factory in Xiaoshan Economic and Technological Development Zone. Initial investment $30 million, total investment 1 billion yuan, with 10 intelligent module packaging production lines. Annual capacity of 60,000 high-end aerospace and automotive-grade IGBT and SiC chips/modules. Production expected to start mid-2024.
“该项目已经开始装修设计阶段,预计于2024年中旬投产通线”compoundsemiconductorchina.net
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