BAE Systems receives multichip prototypes from Intel and Qorvo under SHIP program

BAE Systems accepted the first multichip prototypes from Intel and Qorvo under the Department of Defense's SHIP program. Intel delivered a digital multichip package and Qorvo delivered a radio frequency module, to be transitioned into electronic warfare systems.

“BAE Systems has accepted from Intel and Qorvo the first set of multichip prototypes developed under the Department of Defense's State-of-the-art Heterogeneous Integrated Packaging program.”govconwire.com

• 1 source
• govconwire.comBAE Receives Multichip Prototypes From Intel, Qorvo Under Pentagon’s SHIP Program; Heidi Shyu Quoted – GovCon WireJane EdwardsApr 10, 2023

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