Tongfu Microelectronics holds topping-out ceremony for Phase III project in Suzhou

Nantong Tongfu Microelectronics Co., Ltd. held the topping-out ceremony for its third-phase project at the Su-Xi-Tong Industrial Park on November 30, 2022. The project spans over 100,000 square meters. The announcement was made on December 2, 2022.

“The simultaneous commencement of construction on the third-phase project—spanning over 100,000 square meters—is a rare milestone in the development history of Tongfu Microelectronics Group.”en.tfme.com

• 1 source
• en.tfme.comThe topping-out ceremony for Phase III of Tongfu Microelectronics Co., Ltd. in the Suzhou-Suzhou-Tongzhou Industrial Park was successfully held.-Tongfu Microelectronics Co., Ltd.Dec 2, 2022

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