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Chengdu Gaotou Xinwei Semiconductor Co. started construction of a 1 billion yuan ($148 million) high-end power semiconductor device and module R&D and production project in Chengdu High-tech West Zone. The first phase will build an 8-inch ultra-thin IGBT backside wafer line and a power semiconductor packaging line, with production expected to begin in Q4 2023.
“一期将建设一条8英寸超薄IGBT特色背面晶圆线,一条高端功率半导体集成封装生产线,计划今年年底完成厂房封顶。”sc.people.com.cn
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