Silan Micro subsidiary to build automotive power module packaging plant in Chengdu

Silan Micro's holding subsidiary Chengdu Silan Semiconductor Manufacturing Co., Ltd. plans to invest 3 billion yuan to build an automotive-grade power module packaging project with an annual capacity of 720,000 pieces. The construction period is 3 years.

“Silan Micro plans to invest in the construction of 'annual production capacity of 720,000 pieces of automotive-grade power module packaging project'.”ictransistors.com

• 1 source
• ictransistors.comSilan Micro: The Subsidiary Invested 3 Billion Yuan To Build An Automotive-grade Power Module Packaging Project - Recent News in the field of Electronic Components - News - GNS ComponentsJun 14, 2022

Summarized from public sources; check the original articles before acting on it.