Toshiba to build 300mm power chip plant in Ishikawa

Toshiba will build a new 300mm wafer fabrication plant for power semiconductors in Ishikawa Prefecture, Japan, investing about 100 billion yen ($870 million) to more than double production capacity by March 2025.

“Toshiba Corp. will build a new 300-millimeter wafer fabrication plant for power semiconductors that will more than double its production capacity by March 2025, the company announced Friday.”bloomberg.com

• 1 source
• bloomberg.comToshiba to More Than Double Power Chip Output With New Plant - BloombergVlad SavovFeb 4, 2022

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