Samsung Electro-Mechanics invests $850M in FC-BGA production in Vietnam

Samsung Electro-Mechanics announced an investment of $850 million (approximately KRW 1.1 trillion) in production facilities and infrastructure for Flip Chip-Ball Grid Array (FC-BGA) semiconductor substrates in Vietnam. The investment will be implemented consecutively until 2023.

“The company held a board meeting on the 23rd and announced that it would invest $850 million in production facilities and infrastructure for the production of the Flip Chip (FC)-Ball Grid Array (BGA) in Vietnam.”sammyfans.com

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• sammyfans.comSamsung Electro-Mechanics confirms $850 million investment to expand FC-BGA production - Sammy FansSheetal MalviyaDec 25, 2021

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