Zhuhai Yuexin Semiconductor breaks ground on CNY 3.5B packaging substrate plant

Zhuhai Yuexin Semiconductor Co., Ltd., a subsidiary of Yueya Semiconductor, held a groundbreaking ceremony for a new CNY 3.5 billion high-end RF and FCBGA packaging substrate manufacturing project in Zhuhai's Fushan Industrial Park. The plant will produce Via Post, embedded, and FCBGA substrates.

“2021年12月8日上午，广东省珠海市斗门区富山工业园富山三路南侧、涌南二路以东热闹非凡，彩旗招展，气球高悬，珠海越芯半导体有限公司的'高端射频及FCBGA封装载板生产制造项目奠基仪式'在此隆重举行。”eet-china.com

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