Zhenming Semiconductor to invest 200 million yuan in IC packaging expansion

Zhenming Semiconductor's integrated circuit packaging R&D and industrialization expansion project in Weifang will invest 200 million yuan to achieve annual packaging capacity of 1.8 billion units, with completion expected by December 2021.

“贞明半导体集成电路封装研发及产业化扩产项目，预计2021年12月建成，项目总投资2亿元，形成年封装18亿颗的生产能力。”gxt.shandong.gov.cn

• 1 source
• gxt.shandong.gov.cn山东省工业和信息化厅 市县动态 潍坊市工信局加大项目扶持力度 推动声光电产业发展Aug 25, 2021

Summarized from public sources; check the original articles before acting on it.