Zing Semiconductor breaks ground on 300mm silicon wafer project in Shanghai

Shanghai Zing Semiconductor Co., Ltd. held a groundbreaking ceremony for a new project to add 300,000 pieces of 300mm high-end silicon wafers for integrated circuits, including a new No. 5 plant in Lingang New Area.

“2021年5月25日，上海新昇半导体科技有限公司“新增30万片集成电路用300mm高端硅片研发与制造项目暨五号厂房”开工仪式在临港新片区云水路1000号厂区内举行。”zingsemi.com

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• zingsemi.com新增30万片集成电路用300mm高端硅片研发与制造项目正式开工 | 上海新昇半导体科技有限公司May 25, 2021

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