Keyang Semiconductor completes 8-inch CIS chip wafer-level packaging expansion

Keyang Semiconductor, a subsidiary of *ST Dagang, has completed the first phase expansion of its 8-inch CIS chip wafer-level packaging line, adding 3,000 wafers per month of capacity, which has reached full production.

“科阳半导体8 吋CIS芯片晶圆级封装一期扩产3000片/月已达产”m.cls.cn

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• m.cls.cn*ST大港：科阳半导体8吋CIS芯片晶圆级封装一期扩产3000片/月已达产Feb 19, 2021

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