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TDK to acquire Chirp Microsystems for ultrasonic 3D sensing · Endata

◂ Announcements

Feb 12, 2021ACQUISITIONBerkeley, California, United States

TDK to acquire Chirp Microsystems for ultrasonic 3D sensing

TDK has signed an agreement to acquire Chirp Microsystems, a pioneer in high-performance ultrasonic 3D sensors, to expand its sensor business. The acquisition will combine Chirp's technology with TDK's fingerprint, MEMS, and piezo-ceramic sensors.

Status

Announced

Productsultrasonic 3D sensorsfingerprint sensorsMEMS sensorspiezo-ceramic sensors

CompaniesTDK Corporation acquirer Chirp Microsystems target

Sectors#Semiconductors and Industrial Electronics #Automotive Components

“TDKは高性能超音波3Dセンシングを手掛けるChirp Microsystems, Incの買収契約を締結”tdk.com

1 source
tdk.comセンサ事業のさらなる成長のための Chirp Microsystems, Inc.の買収についてFeb 12, 2021

Summarized from public sources; check the original articles before acting on it.

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