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Orkla will invest over EUR 1 million in a new packaging line for chip bags at its Ādažu Čipsi facility in Latvia. The project, awarded to ABB, aims to automate box packing and increase capacity, to be completed by November 30, 2018.
“Jaunā līnija būtiski kāpinās uzņēmuma produktivitāti un padarīs “Ādažu Čipsu” ražotni vēl konkurētspējīgāku.”la.lv
Summarized from public sources; check the original articles before acting on it.