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Panasonic to start MUF material production in Shanghai · Endata

◂ Announcements

Feb 7, 2018EXPANSIONShanghai, China

Panasonic to start MUF material production in Shanghai

Panasonic announced that Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. will start high-volume manufacturing of molded underfill semiconductor encapsulation materials in March 2018 to meet growing demand in China.

Starts operating

Mar 2018

Status

Announced

Productsmolded underfill semiconductor encapsulation materials

CompaniesPanasonic

Sectors#Semiconductors and Industrial Electronics

“Panasonic will launch the mass production of molded underfill semiconductor encapsulation materials in Shanghai, China in response to the increased production of leading-edge semiconductor packages in the region.”news.panasonic.com

1 source
news.panasonic.comPanasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai | Business Solutions | Products & Solutions | Press Releases | Panasonic Newsroom GlobalFeb 7, 2018

Summarized from public sources; check the original articles before acting on it.

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